Interconnections for 3D memory

ABSTRACT

Apparatuses and methods for interconnections for 3D memory are provided. One example apparatus can include a stack of materials including a plurality of pairs of materials, each pair of materials including a conductive line formed over an insulation material. The stack of materials has a stair step structure formed at one edge extending in a first direction. Each stair step includes one of the pairs of materials. A first interconnection is coupled to the conductive line of a stair step, the first interconnection extending in a second direction substantially perpendicular to a first surface of the stair step.

PRIORITY INFORMATION

This application is a Divisional of U.S. application Ser. No.13/774,522, filed Feb. 22, 2013, which issues as U.S. Pat. No. 9,111,591on Aug. 18, 2015, the contents of which are included herein byreference.

TECHNICAL FIELD

The present disclosure relates generally to semiconductor memoryapparatuses and methods of forming, and more particularly, toapparatuses and methods for interconnections of three-dimensional (3D)memory.

BACKGROUND

Memory devices are typically provided as internal, semiconductor,integrated circuits in computers or other electronic devices. There aremany different types of memory, including random-access memory (RAM),read only memory (ROM), dynamic random access memory (DRAM), synchronousdynamic random access memory (SDRAM), resistive memory, e.g., RRAM, andFlash memory, among others.

Memory devices are utilized as volatile and non-volatile data storagefor a wide range of electronic applications. Flash memory typically usesa one-transistor memory cell that allows for high memory densities, highreliability, and low power consumption. Non-volatile memory may be usedin, for example, personal computers, portable memory sticks, solid statedrives (SSDs), digital cameras, cellular telephones, portable musicplayers such as MP3 players, movie players, and other electronicdevices.

Memory devices can comprise memory arrays of memory cells, which can bearranged in various two or three dimensional configurations. Associatedcircuitry coupled to a memory array can be arranged in a substantiallyplanar configuration, for instance, and can be coupled to memory cellsvia interconnections. Scaling in 3D NAND can be problematic due tocapacitive coupling, among other issues.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A-C are block diagrams illustrating prior art interconnectionsfrom a 3D memory array.

FIG. 2 is a perspective view of a portion of a prior art 3D memoryarray.

FIGS. 3A-D are block diagrams illustrating interconnections from a 3Dmemory array in accordance with a number of embodiments of the presentdisclosure.

FIG. 4 is a perspective view of a portion of a 3D memory array havinginterconnections in accordance with a number of embodiments of thepresent disclosure.

FIG. 5 is a schematic diagram illustrating interconnections for 3Dmemory arrays in accordance with a number of embodiments of the presentdisclosure.

FIG. 6 is a timing diagram illustrating operating signals associatedwith interconnections of a 3D memory device operated in accordance witha number of embodiments of the present disclosure.

FIG. 7 is a block diagram of an apparatus in the form of a computingsystem including at least one 3D memory array in accordance a number ofembodiments of the present disclosure.

DETAILED DESCRIPTION

Apparatuses and methods for interconnections for three dimensional (3D)memory are provided. One example apparatus can include a stack ofmaterials including a plurality of pairs of materials, each pair ofmaterials including a conductive line formed over an insulationmaterial. The stack of materials has a stair step structure formed atone edge extending in a first direction. Each stair step includes one ofthe pairs of materials. A first interconnection is coupled to theconductive line of a stair step, the first interconnection extending ina second direction substantially perpendicular to a first surface of thestair step.

In the following detailed description of the present disclosure,reference is made to the accompanying drawings that form a part hereof,and in which is shown by way of illustration how one or more embodimentsof the disclosure may be practiced. These embodiments are described insufficient detail to enable those of ordinary skill in the art topractice the embodiments of this disclosure, and it is to be understoodthat other embodiments may be utilized and that process, electrical,and/or structural changes may be made without departing from the scopeof the present disclosure.

The figures herein follow a numbering convention in which the firstdigit or digits correspond to the drawing figure number and theremaining digits identify an element or component in the drawing.Similar elements or components between different figures may beidentified by the use of similar digits. As will be appreciated,elements shown in the various embodiments herein can be added,exchanged, and/or eliminated so as to provide a number of additionalembodiments of the present disclosure. In addition, the proportion andthe relative scale of the elements provided in the figures are intendedto illustrate various embodiments of the present disclosure and are notto be used in a limiting sense.

As used herein, the term “substantially” intends that the characteristicneeds not be absolute, but is close enough so as to achieve theadvantages of the characteristic. For example, “substantially parallel”is not limited to absolute parallelism, and can include orientationsthat are intended to be parallel but due to manufacturing limitationsmay not be precisely parallel. For example, “substantially parallel”features are at least closer to a parallel orientation than aperpendicular orientation, and generally are formed within a few degreesof parallel. Similarly, “substantially perpendicular” is not limited toabsolute perpendicularity, and can include orientations that areintended to be parallel but due to manufacturing limitations may not beprecisely perpendicular. For example, “substantially perpendicular”features are at least closer to a perpendicular orientation than aparallel orientation, e.g., within a few degrees of perpendicular.

The terms “first,” “second,” “third,” and “fourth” may be used herein,and/or in the claims, merely for convenience in differentiating thenomenclature of various features from one another. The use of such termsdoes not necessarily imply that the materials are of differentcomposition, but sometimes are used to distinguish between materialsformed at different elevations, at different times, or in differentmanners, even if of the same composition. The use of such terms does notintend to convey a particular ordering of the features, including, butnot limited to, an order of forming.

3D NAND memory can use a stair step structure in order to makerespective conductive lines in a stack of conductive lines eachaccessible to interconnections oriented perpendicular to the conductivelines. However, as the quantity of conductive lines in the stack ofconductive lines increases, the transitions to interconnections canbecome more challenging because quantity of interconnections to beaccomplished within a width of the conductive line stack also increases.Therefore, the scaling of 3D NAND memory can thereby be limited.Arranging conductive lines and/or interconnections in closer proximityto one another also increases capacitive coupling, which can also limitthe scaling of 3D NAND memory. As such, scaling of 3D NAND memory can beimproved by the apparatuses and methods for interconnections for 3Dmemory of the present disclosure.

FIGS. 1A-C are block diagrams illustrating prior art interconnectionsfrom a 3D memory array. For example, FIG. 1A is a side view (in an X-Zplane), FIG. 1B is a top view (in an X-Y plane), and FIG. 1C is an endview (in a Y-Z plane) of a stack of materials 106. The view provided byFIG. 1B is shown by cutline BB in FIG. 1A, and the view provided by FIG.1C is shown by cutline CC in FIG. 1A.

FIG. 1A shows a cross-sectional side view of the stack of materials 106.The stack of materials 106 includes a plurality of pairs of materials101, each pair of materials 101 including a conductive line 105 formedover an insulation material. The insulation material is not explicitlyshown in FIG. 1A, but is located beneath each conductive line 105, suchas to be in the gap between conductive lines shown in FIG. 1A, forexample. The stack of materials 106 has a stair step structure 111formed at an edge. The direction 107 of the conductive lines 105 isshown in FIG. 1A corresponding to the direction of the longest dimensionof a conductive line 105.

A vertical interconnection 112, e.g., a via, is coupled to theconductive line 105 of a stair step. The vertical interconnection 112extends in direction substantially perpendicular to the top surface ofthe conductive line 105 of a stair step. In this example, the topsurface of 105 is in an X-Y plane, and the vertical interconnection 112is in the Z direction. An interconnection 114 is coupled to the verticalinterconnection 112. Interconnection 114 can be a conductive materialsuch as a metal for instance. The direction 109 of interconnection 114is the direction corresponding to the longest dimension ofinterconnection 114. As shown in FIG. 1A, the direction 109 of theinterconnection 114 is in the same direction as the direction 107 of theconductive lines 105, e.g., the X direction, in this example.Interconnection 114 is oriented in a plane parallel to the plane inwhich a conductive line 105 is oriented, e.g., the Y-Y plane, in thisexample.

FIG. 1B shows a top view of the stack of materials 106. A width of thestack of materials 106 is indicated in FIG. 1B as W_(BLK). The stairstep structure 111 includes a number of stair steps, indicated in FIG.1B as N_(WL). The stair step structure 111 shown in FIG. 1A-C includes 4stair steps. The pitch between interconnections 114 is indicated in FIG.1B as P_(MO), is limited to be less than W_(BLK)/N_(WL), for example. Asthe quantity of conductive lines 105 increases, N_(WL) increases, whichcauses P_(MO) to decrease for a given, e.g., constant, W_(BLK). FIG. 1Cis a cross-sectional end view of the stack of materials 106.

FIG. 2 is a perspective view of a portion of a prior art 3D memory array200. The memory array 200 can comprise, for example, a NAND flash memoryarray. Memory array 200 includes a number of vertical strings ofseries-coupled memory cells 203 oriented orthogonal to a number ofconductive lines, such as access lines 205 and/or data lines 202. Asused herein, A “coupled to” B refers to A and B being operativelycoupled together, such as where A and B are electrically connected witheach other, such as through a direct ohmic connection or through anindirect connection.

The 3D memory array 200 can include a stack of materials 206 having aplurality of pairs of materials, each pair including a conductive line205 formed over an insulation material. Insulating materials betweenvarious conductive lines are omitted from FIG. 2 for clarity.

Additionally, the 3D memory array 200 can include first select gate line208 (coupled to first select gates) and second select gate line 210(coupled to second select gates) on either end of the vertical stringsof series-coupled memory cells 203. A first select gate line 208, suchas a drain select gate (SGD) line, can be arranged at a first end of anumber of the vertical strings of series-coupled memory cells 203, and asecond select gate line 210, such as a source select gate (SGS) line,can be arranged at a second end, e.g., opposite end, of the verticalstrings of series-coupled memory cells 203. The 3D memory array 200 canalso include one or more source lines 204.

The stack of materials 206, and optionally select gate lines 208/210,can have a stair step structure 111 formed at their edge. A verticalinterconnection 212, e.g., a via, is coupled to the conductive line 205or select gate lines 208/210 of a stair step. The verticalinterconnection 212 extends in direction substantially perpendicular tothe top surface of the stair step. An interconnection 214 is coupled tothe vertical interconnection 212. Interconnection 214 can extend furtherthan shown in FIG. 2.

FIGS. 3A-D are block diagrams illustrating interconnections from a 3Dmemory array in accordance with a number of embodiments of the presentdisclosure. For example, FIG. 3A is a side view (in an X-Z plane), FIG.3B is a top view (in an X-Y plane), and FIG. 1D is an end view (in a Y-Zplane) of a stack of materials 306. FIG. 3C is a top view (in an X-Yplane) below the stack of materials 306. The view provided by FIG. 3B isshown by cutline BB in FIG. 3A, the view provided by FIG. 3C is shown bycutline CC in FIG. 3A, and the view provided by FIG. 3D is shown bycutline DD in FIG. 3A.

FIG. 3A shows a cross-sectional side view of the stack of materials 306.The stack of materials 306 can include a plurality of pairs of materials301, each pair of materials 301 including a conductive line 305 formedover an insulation material. The insulation material is not explicitlyshown in FIG. 3A, but can be located beneath each conductive line 305,such as to be in the gap between conductive lines shown in FIG. 3A, forexample. Conductive lines 305 can be formed to have a wide width portion327 and a narrow width portion 332, as shown and discussed further withrespect to FIG. 3B.

The stack of materials 306 can have a stair step structure 311 formed onat least one edge. Each stair step includes one of the pairs ofmaterials arranged such that the conductive line 305 thereof isaccessible to an interconnection. The direction of the conductive lines305 shown in FIG. 3A is the same as the direction 107 indicated for theconductive lines 105 shown in FIG. 1A, e.g., X direction.

Ascending, e.g., vertical, interconnections 336, e.g., a vias, can becoupled to the conductive line 305 of respective stair steps. Theascending interconnection 336 can extend in direction substantiallyperpendicular to a top surface 326 of the conductive line 305 of a stairstep. The ascending interconnections 336 are not visible in FIG. 3Abecause they are located behind the corresponding descendinginterconnections 340 (discussed later).

A top planar interconnection 338 can be coupled to the ascendinginterconnection 336. Top planar interconnection 338 need not be routedover the top of memory array 306. The term “top” as used here isintended only to distinguish between interconnections routed in a planeparallel to a plane in a conductive line 305 is formed, e.g.,distinguish interconnections in a parallel plane located above theconductive lines 305 from interconnections in a parallel plane locatedbelow the conductive lines 305.

The top planar interconnections 338 can be formed in a plane, e.g., X-Tplane, substantially parallel to the plane within which the conductivelines 305 are formed. However, the top planar interconnections 338 canbe formed, for example, in a direction perpendicular to each of theconductive lines 305 and the ascending interconnections 336, wheredirection is along the longest dimension of the respective conductivelines 305, ascending interconnections 336, and top planarinterconnections 338. For example, top planar interconnections 338 havea direction into/out of the page in FIG. 3A, e.g., Y direction, which isperpendicular to the conductive lines 305, e.g., extending in an Xdirection, and is perpendicular to the ascending interconnections 336,e.g., extending in a Z direction. According to various examples, topplanar interconnections 338 are formed to be in a direction that isdifferent than the direction of the conductive lines 305.

Descending interconnections 340 can be coupled to the top planarinterconnection 338, as shown in FIG. 3A. The descendinginterconnections 340 can extend to below the bottom pair of materials301 in the stack of materials 306. According to a number of embodiments,the descending interconnections 340 can extend in a same direction asthe ascending interconnections 336, e.g., extending in a Z direction.

The descending interconnections 340 can extend further below the stackof materials 306 than is shown in FIG. 3A. Conductive materials,ascending interconnections 336, top planar interconnections 338, and/ordescending interconnections 340 can be formed of metal or polysilicon,for example, or other doped or undoped materials. Insulating materialscan be formed of oxide, for example, and/or other dielectric materials.

FIG. 3B shows a top view of the stack of materials 306. As mentionedabove, conductive lines 305 can be formed to have a wide width portion327 as indicated by width W1, and a narrow width portion 332 asindicated by width W2, where W1>W2. The width of the stack of materials306 is indicated in FIG. 3B as W_(BLK), which can be the same width asW1. Although FIG. 3B shows the narrow width portion 332 formed at oneside, e.g., along a same edge, of the wide width portion 327,embodiments of the present disclosure are not limited to suchconfigurations, and the narrow width portion 332 can be formed at otherlocations along the width, W_(BLK), of the stack of materials 306.

The stair step structure 311 can be formed on at least one edge of thenarrow width portion 332, and the ascending interconnection 336 can becoupled to conductive line 305 at top surfaces of steps of the stairstep structure 311 within the narrow width portion 332. Stair stepstructure 311 can include a number of stair steps formed in the narrowwidth portion 332, as indicated in FIG. 3B as N_(WL). The stair stepstructure 311 shown in FIGS. 3A, B, and D includes 4 stair steps.However, embodiments of the present disclosure are not limited to aparticular quantity of stair steps. Additional steps can be accommodatedby extending the stair step structure further out away from the widewidth portion 327 of the conductive lines 305.

The pitch between top planar interconnections 338 is indicated in FIG.3B as P_(MO). However, unlike the prior art structure shown in FIG. 1B,and because a greater number of stair steps can be accommodated in thestair step structure 311 by extending the narrow width portion 332further out away from the wide width portion 327 of the conductive lines305, e.g., in an X direction, the pitch between top planarinterconnections 338 is not constrained by W_(BLK) or N_(WL) forembodiments of the present disclosure.

According to a number of embodiments, descending interconnections 340can be the located within an area 334. Area 334 can be adjacent to eachof wide width portion 327 and the narrow width portion 332. Area 334 canhave a width equal to W1-W2, and can have a length equal to the distanceby which the narrow width portion 332 extends from the wide widthportion 327. For example, area 334 can occupy a footprint left where aportion of the stack of materials 306 was removed to form the narrowwidth portion 332, for example. According to some embodiments, thedescending interconnections can be offset from one another so as tomaintain a minimum pitch therebetween in a number of directions, e.g., 2directions.

FIG. 3C is a cross-sectional top view of an elevation below the stack ofmaterials 306. Bottom planar interconnections 342 and 344 can be coupledto respective descending interconnections 340. Bottom planarinterconnections 342 can extend from descending interconnections 340 inone direction, e.g., in an negative X direction, and bottom planarinterconnections 344 can extend from descending interconnections 340 inanother, e.g., different, direction, e.g., in an positive X direction.According to a number of embodiments, bottom planar interconnections 342and 344 extend perpendicularly to each of descending interconnections340 and top planar interconnections 338. According to a number ofembodiments, bottom planar interconnections 342 and 344 extend along asame direction as the conductive lines 305, e.g., along an X direction.

For example, bottom planar interconnections 344 can extend fromdescending interconnections 340 in a direction, e.g., a positive Xdirection, opposite from the direction, e.g., a negative X direction, bywhich bottom planar interconnections 342 extend from descendinginterconnections 340, as shown in FIG. 3C. Bottom planarinterconnections 342 and 344 can extend from descending interconnections340 so as to be parallel to the conductive lines 305. However, thelocations and/or directions to which bottom planar interconnections 342and 344 extend are not limited to those shown in FIG. 3C. That is,bottom planar interconnections 342 and 344 can individually extend invarious radial directions from descending interconnections 340, e.g., inan X-Y plane, and/or can include additional elevation and/or routechanges.

As shown in FIG. 3C, the bottom planar interconnections 342 and 344 canextend in different, e.g., opposite, directions, e.g., in an X-Y plane.In this manner, the pitch, P_(WO), can be relaxed by half, e.g.,N_(WL)/2. For example, a portion, e.g., half, of a string driver, e.g.,line driver, can be placed in one direction and another portion, e.g.,half, placed in a different direction with the two directionscorresponding to the directions in which bottom planar interconnections342 and 344 are respectively routed.

FIG. 3D is a cross-sectional end view of the stack of materials 306, andshows ascending interconnections 336 extending, e.g., in a Z direction,from the conductive line 305 of a stair step in direction substantiallyperpendicular to a plane, e.g., an X-Y plane, of the conductive line305. For example, ascending interconnections 336 can extend from aconductive line 305 located at a top surface of a stair step. FIG. 3Dfurther shows top planar interconnections 338 coupled between ascendinginterconnections 336 and descending interconnections 340, withdescending interconnections 340 located within the width of the stack ofmaterials 306. FIG. 3D also shows descending interconnections 340extending down below the stack of materials 306. Bottom planarinterconnections 342 and 344 are not shown in FIG. 3D.

FIG. 4 is a perspective view of a portion of a 3D memory array 420having interconnections in accordance with a number of embodiments ofthe present disclosure. The memory array 420 can comprise, for example,a 3D NAND flash memory array. Memory array 420 includes a number ofvertical strings of series-coupled memory cells 203 oriented orthogonalto a number of conductive lines, such as access lines 425 and/or datalines 422. The 3D memory array 420 can include a stack of materials 426having a plurality of pairs of materials, each pair including aconductive line 425 formed over an insulation material. Insulatingmaterials between various conductive lines are omitted from FIG. 4 forclarity.

Additionally, the 3D memory array 420 can include first select gate line428 (coupled to first select gates) and second select gate line 430(coupled to second select gates) on either end of the vertical stringsof series-coupled memory cells 423. A first select gate line 428, suchas a drain select gate (SGD) line, can be arranged at a first end of anumber of the vertical strings of series-coupled memory cells 423, and asecond select gate line 430, such as a source select gate (SGS) line,can be arranged at a second end, e.g., opposite end, of the verticalstrings of series-coupled memory cells 423.

The stack of materials 426 can have a stair step structure 424 formed attheir edge. The stair step structure 424 can be formed to also includeother conductive materials, such as the first select gate line 428,second select gate line 430, and/or other conductive structures. Thequantity and arrangement of the various components forming the stairstep structure are not limited to that shown in FIG. 4.

A plurality of data lines 422, e.g., bit lines, can be oriented in afirst plane, e.g., in an X-Y plane, extending in a first direction,e.g., in a Y direction. The vertical strings of series-coupled memorycells 423 can be oriented orthogonal to the first plane, e.g., in a Zdirection. The plurality of access lines 425, e.g., word lines, can beoriented in second direction, e.g., in an X direction, in planesoriented substantially parallel to the first plane, e.g., in X-Y planes.The plurality of access lines 425 can be oriented perpendicular to theplurality of data lines 422, for example. The data lines 422 can beshared by a number of vertical strings of series-coupled memory cells423 in the first direction, and the access lines 425 can be shared by anumber of vertical strings of series-coupled memory cells 423 in thesecond direction. The 3D memory array 420 can include a number of sourcelines 204 (not shown in FIG. 4).

The select gate lines 428 and 430 can operate to select a particularvertical string of series-coupled memory cells 423 between a data line422 and a source line. As such, the vertical strings of series-coupledmemory devices 423 can be located at the intersections of the data lines422 and source lines.

The access lines 425 can be coupled to (and in some cases from) controlgates of memory cells at a particular level and can be used to select aparticular one of the series-coupled memory cells 423 within a verticalstring. In this manner, a particular memory cell 423 can be selected andelectrically coupled to a data line 422 via operation of the firstselect gate line 428, second select gate line 430, and an access line425. The access lines 425 can be configured to select a memory cell 423at a particular location within one or more of the vertical strings ofseries-coupled memory cells 423.

As shown in FIG. 4, stack of materials 426 can be formed to have a widewidth portion 427 and a narrow width portion 432. The narrow widthportion 432 can be formed by removing a portion of the stack ofmaterials 426 initially formed in area 434. The portion of the stack ofmaterials 426 initially formed in area 434 can be removed before, orafter, stair step structure 424 formation. That is, the stack ofmaterials may be initially formed including the portion within area 434,and a stair step structure may be formed along at least a portion of anedge of the stack of materials greater than the narrow width portion432. For example, a stair step structure may be initially formed acrossthe entire width, W_(BLK), of the stack of materials, with the portionof the stack of materials initially formed in area 434 removed(including a portion of the stair step structure formed therein).Alternatively, the narrow width portion 432 can be formed by not formingthe portion of the stack of materials 426 in area 434, or by some otherprocess(es).

The planar access lines 425, and optionally select gate lines, e.g., 428and/or 430, and other materials, can be configured to form a 3D stairstep structure 424 at an edge of the narrow width portion 432 tofacilitate vertically-oriented coupling thereto, such as by ascending,e.g., vertical, conductors 436. That is, respective planar access lines425 can be formed as respective stair steps of the stair step structure424. A stair step structure 424, as used herein, means a 3D structurehaving a plurality of stair steps at different elevations extending todifferent distances in a lateral direction, such as is generallyassociated with a set of stair steps.

According to a number of embodiments of the present disclosure, thesteps of lower elevations can extend laterally beyond the lateraldistance that the step at an immediately higher elevation extends, asshown in FIG. 4. That is, lower steps extend further in a lateraldirection than step(s) above. Embodiments of the present disclosure caninclude a stack of materials 426 having one or more edges having a stairstep configuration. Embodiments of the present disclosure can includeonly a portion, e.g., less than all, of an edge of a stack formed into astair step configuration. For example, embodiments of the presentdisclosure can include that a first portion of one edge of a stack ofmaterials can be formed to have a stair step configuration and a secondportion of the one edge can be formed so as not to have a stair stepconfiguration.

A lower step can extend laterally a sufficient distance beyond a nexthigher step so that a vertical coupling can be made to the portion ofthe lower step extending laterally past the next higher step. In thismanner, an ascending conductor 436 can be coupled to a particular step.

FIG. 4 shows top planar interconnections 438 coupled to respective onesof the ascending interconnection 436. The top planar interconnections438 can be formed in a plane, e.g., an X-Y plane, substantially parallelto the plane within which the conductive lines 425 are formed. However,the top planar interconnections 438 can be formed to extend in adirection, e.g., a Y direction, perpendicular to each of the conductivelines 425, e.g., extending in an X direction, and the ascendinginterconnections 436, e.g., extending in a Z direction, where directionis defined by the longest dimension of the respective conductor.According to a number of embodiments, top planar interconnections 438can be formed in a direction parallel to data lines 422, e.g., a Ydirection, at a same or different elevation.

Descending interconnections 440 can be coupled to the top planarinterconnection 438, as shown in FIG. 4. According to a number ofembodiments, descending interconnections 440 can be located with area434, and conversely, not located outside area 434. The descendinginterconnections 440 can extend to below the stack of materials 426and/or second select gate line 430, and/or source line(s). Thedescending interconnections 340 can extend further below the stack ofmaterials 306 than is shown in FIG. 4. According to a number ofembodiments of the present disclosure, ascending interconnections 436,top planar interconnections 438, and descending interconnections 440 canall be formed of polysilicon, for example, or other doped or undopedmaterials. Bottom planar interconnection are not shown in FIG. 4 forclarity.

The memory array 420 can be coupled to various circuitry associated withoperating the memory array 420. Such circuitry can include a stringdriver, for instance. The circuitry associated with operating the memoryarray 420 can be CMOS circuitry formed near the substrate underneath thememory array 420 and/or below the elevation of the memory array 420 ifnot directly underneath the memory array 420.

As an example, bottom planar interconnections can be routed from thememory array 420, for example, to a string driver. An electricalcoupling can be made between the stack of materials, includingconductive lines 425, select gate lines 428/430, and/or source lines,and the string driver, e.g., via the bottom planar interconnections.

Benefits of a number of embodiments of the present disclosure includethat a stack of conductive materials can include more pairs ofconducting and insulating materials than can be accommodated for a givenpitch design rule in an arrangement where the ascending interconnections436 are confined to the width, W_(BLK), of the stack of conductivematerials, which is constrained by the quantity W_(BLK)/N_(WL).

FIG. 5 is a schematic diagram illustrating interconnections for 3Dmemory arrays in accordance with a number of embodiments of the presentdisclosure. FIG. 5 shows first 562 and second 563 memory arrays. Each offirst 562 and second 563 memory arrays include a number of verticalstrings of series-coupled memory cells between a data line (BL) andsource line (SRC). The vertical strings of series-coupled memory cellsare controlled by a number of access lines, e.g., WL0, WL1, WL2, WL3, adrain select gate (SGD), and source select gate (SGS).

FIG. 5 illustrates coupling between the first 562 and second 563 memoryarrays and global control lines 566, e.g., GSGS, GWL0, GWL1, GWL2, GWL3,and GSGD. The particular one of first 562 and second 563 memory arrayscoupled to the global control lines 566 is determined by operation ofselection transistors controlled by block select control lines, e.g.,Blksel(n) 564 can be asserted to couple first 562 memory array to theglobal control lines 566, and Blksel(n+1) 565 can be asserted to couplesecond 563 memory array to the global control lines 566. Each memoryarray has local control lines, e.g., access lines, select gate lines,selectively coupleable to global control lines 566.

The selection transistors can be located under the memory array, e.g.,562 and/or 563, such as beneath but within a footprint of the memoryarray, or can be located at some elevation, e.g., below, but outside ofa footprint of the memory array, or a combination of both, e.g., someselection transistors can be located under the memory array within afootprint of the memory array and other selection transistors can belocated outside of a footprint of the memory array at a same ordifferent elevation. The local control lines, e.g., access lines, selectgate lines, can be formed for a 3D memory array, for example, as wasdescribed with respect to FIGS. 3A and 3B using a stair step structureto expose the local control lines, which can be coupled to ascendinginterconnections, and optionally top planar interconnections anddescending interconnections, to be appropriately routed to selectiontransistors, as such routing was previously described. The globalcontrol lines 566 can be routed under the memory array, or over thememory array, e.g., 562, 563, or a combination of both, e.g., someglobal control lines 566 can be routed under the memory array and someglobal control lines 566 can be routed over the memory array.

Table 1 provides example operating parameters, e.g., voltages, forreading, programming, and erasing based on WL1 being selected forreading and programming, and first 562 memory array being selected withBlksel(n) high and second 563 memory array being deselected withBlksel(n+1) low:

TABLE 1 Signal Read Program Erase Blksel(n) 6 V 22 V  6 V Blksel(n + 1)0 V 0 V 0 V BL(n) 1 V 2 V(“1”)/0 V(“0”) float BL(n + 1) 0 V 2 V float SL0 V 0 V float GSGS 4 V 0 V float GWL0, 2, 3 4 V 8 V 0 V GWL1 0 V 18 V  0V GSGD 4 V 2 V float SGS(n) 4 V 0 V float WL0, 2, 3(n) 4 V 8 V 0 V WL1 0V 18 V  0 V SGD(n) 4 V 2 V float SGS(n + 1) 0 V 0 V float WL0-3(n + 1)float float float SGD(n + 1) 0 V 0 V float

According to a number of embodiments of the present disclosure, stringdrivers 559 of a regulator 558 are coupled to the respective globalcontrol lines 566. The string drivers 559 of a regulator 558 arecontrolled by a regulator enable (Reg_en) signal 561. Equalizingtransistors 562 are located between pairs of global control lines 566such that when the equalizing transistors 562 are operated they providea conductive path between pairs of global control lines 566. Theequalizing transistors 562 are controlled by an equalizing enable(Eq_en) signal 560.

According to a number of embodiments, after a program and/or readoperation is completed, the string drivers 559 of a regulator 558 aredisabled, such as by the regulator enable signal 561 going low. Theglobal access lines and select gates, e.g., GWLs, GSGS, and GSGD, areleft floating. The equalizing transistors 562 are operated so as toconduct, such as by equalizing enable signal 560 going high.

Although there can be large voltage differences between global controllines 566 during program and read operations, after equalization, theglobal control lines 566, and the local control lines coupled to theglobal control lines 566, can have substantially equal potential.

Subsequent to the above-described equalization, the global control lines566, and the local control lines coupled to the global control lines566, can be discharged to a reference potential, e.g., ground. Althoughthere can be capacitance between conductive lines in the memory arraybecause of the 3D configuration of the memory array, after equalizationand discharge to the reference potential, the global control lines 566,and the local control lines coupled to the global control lines 566, donot have a negative potential.

According to an alternative embodiment, instead of, or in addition to,discharging the global control lines 566, and the local control linescoupled to the global control lines 566, to a reference potential, eachof the global control lines 566, and the local control lines coupled tothe global control lines 566, can be individually controlled, e.g., by acorresponding string driver 559, to bias to another potential other thanthe reference potential, e.g., ground, in preparation for a nextoperation.

FIG. 6 is a timing diagram illustrating operating signals associatedwith interconnections of a 3D memory device operated in accordance witha number of embodiments of the present disclosure. The operating signalsshown in FIG. 6 are based on WL0 being selected in case of a programoperation and deselected in case of a read operation, and WL1 beingdeselected in case of a program operation and selected in case of a readoperation. Time period 670 corresponds to the time during which arespective read or program operation occurs, time period 672 correspondsto the time period during which an equalization operation occurs, andtime period 673 corresponds to the time period during which a dischargeoperation occurs.

During time period 670, the regulator enable (Reg_en) signal 676 ishigh, enabling string drivers, e.g., 559 in FIG. 5, to drive voltages ofparticular access line, e.g., WL0 voltage signal is shown high for anexample program operation and WL1 voltage signal is shown high for anexample read operation. The equalization circuits, e.g., equalizingtransistors 562 in FIG. 5, are disabled during program and readoperations as shown by the equalizing enable (Eq_en) signal being low,such that equalizing transistors 562 in FIG. 5 are not conducting.

During time period 670, e.g., after program or read operations, theReg_en signal 676 goes low thereby disabling string drivers, e.g., 559in FIG. 5, and the Eq_en signal goes high, such that equalizingtransistors 562 in FIG. 5 are conducting, e.g., to couple WL0 and WL1together. As a result, the voltage on each of WL0 and WL1 is driven to asame, e.g., equalized, voltage as shown in FIG. 6.

Subsequent to equalizing, the Eq_en signal goes low, thereby causingequalizing transistors 562 in FIG. 5 to not be conducting, e.g.,isolating WL0 from WL1. During time period 673, Reg_en signal 676 goeshigh, enabling string drivers, e.g., 559 in FIG. 5, which can be used todrive voltages of a number of access lines, e.g., WL0 and WL1, to avoltage different than the equalized voltage, as is shown in FIG. 6.

FIG. 7 is a block diagram of an apparatus in the form of a computingsystem 780 including at least one 3D memory array 720 in accordance anumber of embodiments of the present disclosure. As used herein, amemory system 784, a controller 790, a memory device 792, or a memoryarray 720 might also be separately considered an “apparatus.” The memorysystem 784 can be a solid state drive (SSD), for instance, and caninclude a host interface 788, a controller 790, e.g., a processor and/orother control circuitry, and a number of memory devices 792, e.g., solidstate memory devices such as NAND flash devices, which provide a storagevolume for the memory system 784. A memory device 792 can comprise anumber of memory arrays 720, such as memory array 420 shown in FIG. 4,or memory arrays 562/563 shown in FIG. 5.

In a number of embodiments, the controller 790, the number of memorydevices 792, and/or the host interface 788 can be physically located ona single die or within a single package, e.g., a managed NANDapplication.

The controller 790 can be coupled to the host interface 788 and to thenumber of memory devices 792 via one or more channels and can be used totransfer data between the memory system 784 and a host 782. Theinterface 788 can be in the form of a standardized interface. Forexample, when the memory system 784 is used for data storage in acomputing system 780, the interface 788 can be a serial advancedtechnology attachment (SATA), peripheral component interconnect express(PCIe), or a universal serial bus (USB), among other connectors andinterfaces. In general, however, interface 788 can provide an interfacefor passing control, address, data, and other signals between the memorysystem 784 and a host 782 having compatible receptors for the hostinterface 788.

Host 782 can be a host system such as a personal laptop computer, adesktop computer, a digital camera, a mobile telephone, or a memory cardreader, among various other types of hosts. Host 782 can include asystem motherboard and/or backplane and can include a number of memoryaccess devices, e.g., a number of processors. Host 782 can be coupled tothe host interface 788 by a communication channel 786.

The controller 790 can communicate with the number of memory devices 792to control data read, write, and erase operations, among otheroperations, including equalization, discharge, and string driveroperations. The controller 790 can include, for example, a number ofcomponents in the form of hardware and/or firmware, e.g., one or moreintegrated circuits, and/or software for controlling access to thenumber of memory devices 792 and/or for facilitating data transferbetween the host 782 and the number of memory devices 792.

The number of memory devices 792 can include a number of arrays ofmemory cells, e.g., arrays, such as those shown in FIGS. 4 and 5. Thearrays can be flash arrays with a NAND architecture, for example.However, embodiments are not limited to a particular type of memoryarray or array architecture. The memory cells can be grouped, forinstance, into a number of blocks including a number of physical pages.A number of blocks can be included in a plane of memory cells and anarray can include a number of planes.

Although specific embodiments have been illustrated and describedherein, those of ordinary skill in the art will appreciate that anarrangement calculated to achieve the same results can be substitutedfor the specific embodiments shown. This disclosure is intended to coveradaptations or variations of various embodiments of the presentdisclosure. It is to be understood that the above description has beenmade in an illustrative fashion, and not a restrictive one. Combinationof the above embodiments, and other embodiments not specificallydescribed herein will be apparent to those of skill in the art uponreviewing the above description. The scope of the various embodiments ofthe present disclosure includes other applications in which the abovestructures and methods are used. Therefore, the scope of variousembodiments of the present disclosure should be determined withreference to the appended claims, along with the full range ofequivalents to which such claims are entitled.

In the foregoing Detailed Description, various features are groupedtogether in a single embodiment for the purpose of streamlining thedisclosure. This method of disclosure is not to be interpreted asreflecting an intention that the disclosed embodiments of the presentdisclosure have to use more features than are expressly recited in eachclaim. Rather, as the following claims reflect, inventive subject matterlies in less than all features of a single disclosed embodiment. Thus,the following claims are hereby incorporated into the DetailedDescription, with each claim standing on its own as a separateembodiment.

What is claimed is:
 1. An apparatus, comprising: a memory array having astack of conductive lines with a wide width portion and a narrow widthportion, the narrow width portion having a stair step structure; and acontroller coupled to the memory array, the controller configured tocontrol: performing a number of operations; and equalizing potential ofaccess lines for a block of the memory array after the number ofoperations is completed, wherein the stack of conductive lines iscoupled to circuitry below the memory array through top planarinterconnections coupled between ascending interconnections anddescending interconnections, the top planar interconnections have alongest dimension in a direction different from a direction of a longestdimension of the conductive lines.
 2. The apparatus of claim 1, whereinthe conductive lines, the ascending interconnections, the descendinginterconnections, and the top planar interconnections are all formed ofa same conductive material.
 3. The apparatus of claim 1, wherein thestack of conductive lines are coupled to circuitry below the memoryarray through bottom planar interconnections located below the memoryarray coupled to the descending interconnections.
 4. The apparatus ofclaim 1, wherein the descending interconnections have a longestdimension in a direction substantially the same as the direction of thelongest dimension of the conductive lines.
 5. The apparatus of claim 1,wherein the controller is configured to control discharging theequalized access lines of the block of memory array to a groundreference potential.
 6. The apparatus of claim 1, wherein the controlleris configured to control discharging the equalized access lines of theblock of memory array to potentials different than a ground referencepotential.
 7. The apparatus of claim 1, wherein the controller isconfigured to control equalizing potential of a select gate line for theblock of the memory array after the number of operations is completed.8. The apparatus of claim 7, wherein the controller is configured tocontrol discharging the equalized select gate line of the block ofmemory array to a ground reference potential.
 9. The apparatus of claim7, wherein the controller is configured to control discharging theequalized select gate line of the block of memory array to a potentialdifferent than a ground reference potential.
 10. An apparatus,comprising: a memory array having access lines with a wide width portionand a narrow width portion, the access lines coupled to a plurality ofmemory cells and control circuitry, wherein the control circuitry isconfigured to: perform a read or write operation; and equalize potentialof access lines after the read or write operation is performed, whereinthe access lines are coupled to the plurality of memory cells at leastat the wide width portion of the access lines, and wherein the accesslines are coupled to the control circuitry through ascending anddescending interconnections coupled to top planar interconnections. 11.The apparatus of claim 10, wherein the control circuitry is configuredto discharge potential of equalized access lines to a ground referencepotential.
 12. The apparatus of claim 10, wherein the control circuitryis configured to equalize select gate lines of the memory array to theequalized potential of access lines after the read or write operation isperformed.
 13. The apparatus of claim 12, wherein the control circuitryis configured to discharge potential of select gate lines to a groundreference potential.
 14. A method of operating a memory, comprising:performing a read operation or a program operation; equalizing potentialof access lines for a block of a memory array after the read operationor the program operation is completed, wherein the memory is a threedimensional memory array including a stack of conductive lines with awide width portion and a narrow width portion, the narrow width portionhaving a stair step structure.
 15. The method of claim 14, wherein thestack of conductive lines is coupled to circuitry below the memory arraythrough top planar interconnections coupled between ascendinginterconnections and descending interconnections, the top planarinterconnections have a longest dimension in a direction different froma direction of a longest dimension of the conductive lines.
 16. Themethod of claim 14, further comprising discharging the equalized accesslines of the block of memory array to a ground reference potential. 17.The method of claim 16, further comprising discharging select gate linesof the block of memory array to a ground reference potential.
 18. Themethod of claim 14, further comprising discharging the equalized accesslines of the block of memory array to a potential different than aground reference potential.
 19. The method of claim 17, whereindischarging select gate lines includes coupling select gate lines toaccess lines.
 20. The method of claim 14, comprising biasing potentialof select gate lines to a potential different than the potential ofequalized access lines.